He aha nā ʻokoʻa ma waena o ka hoʻohaʻahaʻa ʻana i ka ea solder leveling, ke kala immersion a me ka pahu immersion ma ka PCB surface treatment process?

1、Ea wela solder leveling

Ua kapa ʻia ka papa kala ʻulaʻula tin hot air solder leveling board.ʻO ka pāpaʻi ʻana i kahi papa tin ma ka ʻaoʻao o waho o ke kaapuni keleawe he conductive i ka wili.Akā ʻaʻole hiki ke hāʻawi i ka hilinaʻi pili lōʻihi e like me ke gula.Ke hoʻohana lōʻihi loa ia, maʻalahi ka oxidize a me ka ʻōpala, e hopena i ka pilina maikaʻi ʻole.

Pono:Haʻahaʻa kumu kūʻai, maikaʻi kuʻihao hana.

Nā hemahema:ʻAʻole maikaʻi ka palahalaha ʻili o ka ea wela solder leveling board, ʻaʻole kūpono ia no ka wili ʻana i nā pine me nā wahi liʻiliʻi a me nā mea liʻiliʻi liʻiliʻi.He mea maʻalahi ka hana ʻana i nā pahu tinʻO ka hana PCB, ka mea maʻalahi e hoʻopōkole i nā ʻāpana pin āpau liʻiliʻi.Ke hoʻohana ʻia i ke kaʻina hana SMT ʻaoʻao ʻelua, maʻalahi loa ka hoʻoheheʻe ʻana i ke tin hehee, ka hopena i nā pahu tin a i ʻole nā ​​kiko spherical tin, e hopena i ka ʻili ʻole a pili i nā pilikia wili.

2、Kālā kaiapuni

He mea maʻalahi a wikiwiki hoʻi ke kaʻina hana kālā.ʻO ke kala immersion he hopena hoʻoneʻe, kahi kokoke i ka submicron ka uhi kālā maʻemaʻe (5 ~ 15 μ In, ma kahi o 0.1 ~ 0.4 μm). ʻO kekahi manawa i ke kaʻina o ka hoʻoheheʻe kālā ʻia kekahi mau mea kūlohelohe, ka mea nui e pale i ka corrosion kālā a hoʻopau i ka pilikia o ka neʻe kālā. ʻOiai inā ʻike ʻia i ka wela, ka haʻahaʻa a me ka haumia, hiki nō ke hāʻawi i nā waiwai uila maikaʻi a mālama i ka weldability maikaʻi, akā e nalowale ka luster.

Pono:Ke kala impregnated kuʻihao ili i maikai weldability a me ka coplanarity.I ka manawa like, ʻaʻole ia he mau keʻena conductive e like me OSP, akā ʻaʻole maikaʻi kona ikaika e like me ke gula ke hoʻohana ʻia e like me ka ʻili pili.

Nā hemahema:Ke hōʻike ʻia i ka ʻāina pulu, e hoʻopuka ke kālā i ka neʻe electron ma lalo o ka hana o ka volta.ʻO ka hoʻohui ʻana i nā mea kūlohelohe i ke kālā hiki ke hōʻemi i ka pilikia o ka neʻe ʻana o ka electron.

3、Pina kaiapuni

ʻO ke kīʻaha ʻo ia ka solder wicking.I ka wā ma mua, ua maʻalahi ka PCB i ka ʻumi ʻumi ma hope o ke kaʻina hana immersion tin.ʻO ka ʻumi ʻumi a me ka neʻe ʻana i ka tin i ka wā wili e hōʻemi i ka hilinaʻi.Ma hope o kēlā, hoʻohui ʻia nā mea hoʻohui organik i ka hopena immersion tin, i mea granular ka ʻōnaehana papa tin, e lanakila ana i nā pilikia ma mua, a loaʻa nō hoʻi ke kūpaʻa wela maikaʻi a me ka weldability.

Nā hemahema:ʻO ka nāwaliwali nui o ka hoʻomaʻamaʻa tin ʻo kona ola lawelawe pōkole.ʻOi loa ke mālama ʻia i loko o kahi ʻano wela kiʻekiʻe a me ka haʻahaʻa haʻahaʻa, e hoʻomau ka ulu ʻana o nā pūhui ma waena o nā metala Cu/Sn a hiki i ka nalowale ʻana o ka solderability.No laila, ʻaʻole hiki ke mālama ʻia nā papa impregnated tin no ka lōʻihi loa.

Loaʻa iā mākou ka hilinaʻi i ka hāʻawi ʻana iā ʻoe i ka hui maikaʻi loa olawelawe hui PCB turnkey, ka maikaʻi, ke kumu kūʻai a me ka manawa hāʻawi i kāu ʻāpana liʻiliʻi liʻiliʻi PCB hui kauoha a me ka Mid batch Volume PCB kauoha hui.

Inā ʻoe e ʻimi nei i kahi mea hana hui PCB kūpono, e ʻoluʻolu e hoʻouna i kāu faila BOM a me nā faila PCB isales@pcbfuture.com.He hūnā loa kāu mau faila a pau.E hoʻouna mākou iā ʻoe i kahi ʻōlelo pololei me ka manawa alakaʻi i nā hola 48.