ʻO ka Papa Kaapuni Paʻi ka pōhaku kihi o nā huahana uila, he mea nui ia no ka holo paʻa ʻana o kāu huahana no ka manawa lōʻihi a ʻaʻole paha.Ma ke ʻano he mea hana PCB a me PCB Assembly, ua kau ʻo PCBFuture i kahi waiwai kiʻekiʻe ma ka maikaʻi o nā papa kaapuni.
Hoʻomaka ʻo PCBFuture mai ka ʻoihana PCB Fabrication, a laila e hoʻonui i ka hui PCB a me nā lawelawe sourcing ʻāpana, i kēia manawa ua lilo i hoʻokahi o ka mea hana hui PCB turnkey maikaʻi loa.Hoʻoikaika nui mākou e hoʻokomo i nā mea hana kiʻekiʻe no ka ʻenehana ʻoi aku ka maikaʻi, ka ʻōnaehana kūloko i hoʻopaʻa ʻia no ka maikaʻi ʻoi aku ka maikaʻi, e hoʻoikaika i nā limahana no nā mākau ʻoi aku ka maikaʻi.
| Kaʻina hana | 'ikamu | Hiki i ke kaʻina hana | |
| ʻIkepili kumu | Hana Hana | Helu papa | 1-30 papa |
| Kūlou a wili | 0.75% maʻamau, 0.5% holomua | ||
| Min.pau ka nui PCB | 10 x 10mm(0.4 x 0.4") | ||
| Max.pau ka nui PCB | 530 x 1000mm(20.9 x 47.24 ") | ||
| Paʻi nui no nā vias makapō/ kanu ʻia | Paʻi pinepine Cycle≤3 manawa | ||
| Ka mānoanoa o ka papa | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Pau ka mānoanoa o ka papa | +/-10% maʻamau, +/-0.1mm holomua | ||
| Hoʻopau ʻili | HASL, Lead free HASL, Flash gula, ENIG, Paʻa gula paʻa, OSP, Immersion Tin, Immersion kala, etc. | ||
| Hoʻopau ʻili koho | ENIG+ manamana gula, Flash gula+ manamana gula | ||
| ʻAno Mea | FR4, Aluminum, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, etc. | Hiki ke kūʻai aku i nā mea e like me ke noi | |
| Pepa keleawe | 1/3oz ~ 10oz | ||
| ʻAno Prepreg | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, etc. | |
| Ho'āʻo hilinaʻi | Ka ikaika ʻili | 7.8N/cm | |
| Hoʻomāliʻi | 94V-0 | ||
| ʻinoʻino ionic | ≤1ug/cm² | ||
| Min.mānoanoa dielectric | 0.075mm(3mil) | ||
| Ka hoʻomanawanui impedance | +/- 10%, min hiki ke hoʻomalu +/- 7% | ||
| Papa loko a me ka ʻaoʻao waho Hoʻololi Kiʻi | Hiki Mīkini | Mīkini Holoi | Mānoanoa waiwai: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Nui waiwai: min.228 x 228mm(9 x 9") | |||
| Laminator, Hōʻike | Mānoanoa waiwai: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Nui waiwai: min 203 x 203mm(8 x 8"), ka nui o 609.6 x 1200mm(24 x 30 ") | |||
| Laina Etching | Mānoanoa waiwai: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Nui waiwai: min.177 x 177mm(7 x 7") | |||
| ʻĀpana kaʻina hana hiki | Min.laula laina i loko | 0.075/0.075mm(3/3mil) | |
| Min.kaawale mai ka lihi puka a hiki i ka conductive | 0.2mm(8mil) | ||
| Min.apo annular pae loko | 0.1mm(4mil) | ||
| Min.kaawale kaawale o loko | 0.25mm(10mil) maʻamau, 0.2mm(8mil) holomua | ||
| Min.kaawale mai ka lihi papa a hiki i ka conductive | 0.2mm(8mil) | ||
| Min.ākea ākea ma waena o ka lepo keleawe | 0.127mm(5mil) | ||
| E hoʻokaʻawale i ka mānoanoa keleawe no ke kumu o loko | H/1oz, 1/2oz | ||
| Max.mānoanoa keleawe pau | 10oz | ||
| Lapa waho Ka hiki ke kaʻina hana | Min.laula laina waho/ kaawale | 0.075/0.075mm(3/3mil) | |
| Min.nui pad puka | 0.3mm(12mil) | ||
| Hiki i ke kaʻina hana | Max.ka nui o ka hale lole | 5 x 3mm(196.8 x 118mil) | |
| Max.ka nui o ka lua hale lole | 4.5mm(177.2mil) | ||
| Min.laula ʻāina hale lole | 0.2mm(8mil) | ||
| Min.apo annular | 0.1mm(4mil) | ||
| Min.BGA pitch | 0.5mm(20mil) | ||
| AOI | Hiki Mīkini | Orbotech SK-75 AOI | Mānoanoa waiwai: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Nui waiwai: max.597 ~ 597mm(23.5 x 23.5") | |||
| Orbotech Ves Mīkini | Mānoanoa waiwai: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Nui waiwai: max.597 ~ 597mm(23.5 x 23.5") | |||
| ʻO ka ʻeli ʻana | Hiki Mīkini | Mīkini wili MT-CNC2600 | Mānoanoa waiwai: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Nui waiwai: max.470 ~ 660mm(18.5 x 26") | |||
| Min.ka nui o ka lua: 0.2mm(8mil) | |||
| Hiki i ke kaʻina hana | Min.nui-hit drill bit nui | 0.55mm(21.6mil) | |
| Max.lākiō hiʻohiʻona (ka nui o ka papa VS ka nui Drill) | 12:01 | ||
| ʻO ka ʻae ʻana i kahi lua (hoʻohālikelike ʻia me CAD) | +/-3mil | ||
| Puka counterbore | PTH&NPTH, kihi luna 130°, anawaena o luna <6.3mm | ||
| Min.kaawale mai ka lihi puka a hiki i ka conductive | 0.2mm(8mil) | ||
| Max.nui bit drill | 6.5mm(256mil) | ||
| Min.nui-hit slot nui | 0.45mm(17.7mil) | ||
| ʻO ka ʻae ʻana i ka nui o ka puka no ka paʻi kūpono | +/-0.05mm(+/-2mil) | ||
| Min.ʻO ka ʻae ʻana i ka nui o ka slot PTH | +/-0.15mm(+/-6mil) | ||
| Min.ʻO ka ʻae ʻana i ka nui o ka slot NPTH | +/-2mm(+/-78.7mil) | ||
| Min.kaawale mai ka lihi puka a hiki i ka conductive (Blind vias) | 0.23mm(9mil) | ||
| Min.ka nui wili laser | 0.1mm(+/-4mil) | ||
| Countersink hole angle&Diameter | Kiekie 82,90,120° | ||
| Kaʻina Mākū | Hiki Mīkini | Laina hoʻopaʻa ʻia ʻo Panel&Pattern | Mānoanoa waiwai: 0.2 ~ 7.0mm(8 ~276mil) |
| Nui waiwai: max.610 x 762mm(24 x 30") | |||
| ʻO ka hana hoʻopaʻa ʻana | Mānoanoa waiwai: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Nui waiwai: min.203 x 203mm(8" x 8") | |||
| Laina Desmear | Mānoanoa waiwai: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Nui waiwai: max.610 x 762mm(24 x 30") | |||
| Laina hoʻoheheʻe tin | Mānoanoa waiwai: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Nui waiwai: max.610 x 762mm(24 x 30") | |||
| Hiki i ke kaʻina hana | mānoanoa keleawe pā puka | awelika 25um(1mil) maʻamau | |
| Pau ka mānoanoa keleawe | ≥18um(0.7mil) | ||
| Min laula laina no ka kaha kaha ʻana | 0.2mm(8mil)) | ||
| Max.finished keleawe kaumaha no loko & waho papa | 7oz | ||
| ʻOkoʻa ka mānoanoa keleawe | H/1oz,1/2oz | ||
| Palekana Solder & Silkscreen | Hiki Mīkini | Mīkini Holoi | Mānoanoa mea: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Nui waiwai: min.228 x 228mm(9 x 9") | |||
| Mea hōʻike | Mānoanoa waiwai: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Nui waiwai: max.635 x 813mm(25 x 32") | |||
| E hoʻomohala i ka mīkini | Mānoanoa waiwai: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Nui waiwai: min.101 x 127mm(4 x 5") | |||
| kalakala | Ka waihoʻoluʻu mask solder | ʻOmaomao, ʻōmaʻomaʻo matte, melemele, ʻeleʻele, uliuli, ʻulaʻula, keʻokeʻo | |
| kala silkscreen | Keʻokeʻo, melemele, ʻeleʻele, uliuli | ||
| Hiki iā Solder Mask | Min.wehe ʻana i ka huna huna | 0.05mm(2mil) | |
| Max.hoʻopili ʻia me ka nui | 0.65mm(25.6mil) | ||
| Min.laula no ka uhi laina e S/M | 0.05mm(2mil) | ||
| Min.solder mask legend width | 0.2mm(8mil) maʻamau, 0.17mm(7mil) holomua | ||
| Min.mānoanoa solder mask | 10um(0.4mil) | ||
| Ka mānoanoa solder mask no ka hale lole | 10um(0.4mil) | ||
| Min.kalapona ʻaila laina laula/wāwā | 0.25/0.35mm(10/14mil) | ||
| Min.mea huli kalapona | 0.06mm(2.5mil) | ||
| Min.kalapona ʻaila laina meheu | 0.3mm(12mil)) | ||
| Min.kaawale mai ke ano kalapona a i na pad | 0.25mm(10mil) | ||
| Min.laula no ka laina uhi uhi peelable/pad | 0.15mm(6mil) | ||
| Min.solder mask ākea alahaka | 0.1mm(4mil)) | ||
| Solder mask ʻoʻoleʻa | 6H | ||
| Hiki i ka Peelable Mask | Min.ka hoʻokaʻawale ʻana mai ke kumu peelable mask a i ka pad | 0.3mm(12mil)) | |
| Max.ka nui no ka puka hale lole peelable mask (Ma ka paʻi pale) | 2mm(7.8mil) | ||
| Max.ka nui no ka puka hale lole peelable mask (Ma ka paʻi alumini) | 4.5mm | ||
| Ka mānoanoa peelable mask | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Hiki iā Silkscreen | Min.laula laina silkscreen | 0.11mm(4.5mil) | |
| Min.kiʻekiʻe laina silkscreen | 0.58mm(23mil) | ||
| Min.kaawale mai ka moolelo a i ka papa | 0.17mm(7mil) | ||
| Hoʻopau ʻili | Hiki ke hoʻopau i ka ʻili | Max.manamana lima gula lōʻihi | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nikela, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gula | ||
| manamana gula | 3 ~ 5um(0.11 ~ 197mil) nikela, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gula | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL Mīkini | Mānoanoa waiwai: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Nui waiwai: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Paʻa gula paʻa | 1-5u" | ||
| Tin Immersion | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Kālā Kaiapuni | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| E-Hoao | Hiki Mīkini | Mea hōʻike ʻike lele | Mānoanoa mea: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Nui waiwai: max.498 x 597mm(19.6 ~ 23.5") | |||
| Min.kaawale mai ka papa hoao a i ka lihi papa | 0.5mm(20mil) | ||
| Min.conductive resistance | 5Ω | ||
| Max.kūʻokoʻa kūʻokoʻa | 250mΩ | ||
| Max.voli hoao | 500V | ||
| Min.ka nui o ka papa hoao | 0.15mm(6mil)) | ||
| Min.hoʻāʻo ʻana i ka pad spacing | 0.25mm(10mil) | ||
| Max.hōʻike i kēia manawa | 200mA | ||
| Ka hoʻopaʻa inoa | Hiki Mīkini | ʻAno hoʻopaʻa inoa | ʻO ke ala ʻana o NC, ʻoki V, nā ʻaoʻao slot, ka lua peʻa |
| NC routing machine | Mānoanoa waiwai: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Nui waiwai: max.546 x 648mm(21.5 x 25.5") | |||
| Mīkini ʻoki V | Mānoanoa waiwai: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| ʻOi aku ka laulā kumu no ka ʻoki V: 457mm(18") | |||
| Hiki i ke kaʻina hana | Min.ka nui bit routing | 0.6mm(23.6mil) | |
| Min.hoʻomanawanui outline | +/-0.1mm(+/-4mil) | ||
| ʻAno kihi ʻoki V | 20°, 30°, 45°, 60° | ||
| ʻO ka ʻae ʻana o ke kihi ʻoki V | +/-5° | ||
| V-oki kakau inoa tolerance | +/-0.1mm(+/-4mil ) | ||
| Min.kaawale manamana lima gula | +/-0.15mm(+/-6mil) | ||
| ʻO ka ʻae ʻana i ke kihi bevelling | +/-5° | ||
| Noho ka bevelling i ka mānoanoa hoʻomanawanui | +/-0.127mm(+/-5mil) | ||
| Min.radius loko | 0.4mm(15.7mil) | ||
| Min.kaawale mai conductive a outline | 0.2mm(8mil) | ||
| ʻO ka ʻae ʻana i ka hohonu o Countersink/Counterbore | +/-0.1mm(+/-4mil) | ||